| 1 | Materials | Tg130、Tg150、Tg170、Tg180、Halogen free、CEM-1、CEM-3、Low CTE、High CTI (CTI≥400V) CTI≥600V) 、High Frequency(Rogers,Taconic) |
| 2 | Layers count | 1-32 layers |
| 3 | HDI Layers count | 4-16 layers |
| 4 | HDI Stack up | 1+N+1、2+N+2、 3+N+3 |
| 5 | Finished Board Thickness | 0.25mm–6.0mm |
| 6 | Finished board TK (TK≥0.8mm) | ±8% |
| 7 | Finished board TK (0.8mm＞TK≥0.3mm) | ±0.076mm |
| 8 | Min. inner layer core thickness | 0.05mm (excluding copper) |
| 9 | Copper foil thickness | 1/3oz-8oz |
| 10 | Finished board size | Min. 50mm×50mm Max. 780mm×600mm |
| 11 | Max. panel size | 820mm ×390mm |
| 12 | Min. Inner Line Width/Spacing | 0.075/0.075mm |
| 13 | Min. outer Line width/spacing | 0.075/0.075mm |
| 14 | Mis-registration between layers | ± 0.05mm(1sheet 106 prepreg) |
| 15 | Hole to pattern registration | ±0.035mm |
| 16 | Pattern registration tolerance between top and bottom layers | ±0.035mm |
| 17 | Laser drilling size | 0.1-0.2mm |
| 18 | drilling bit size | 0.20mm-6.35mm |
| 19 | Min. finished hole size | 0.15mm |
| 20 | Finished hole size tolerance | ± 0.05mm |
| 21 | Hole position precision | ± 0.05mm |
| 22 | PTH hole copper thickness | ≥20um |
| 23 | Countersink hole depth tolerance | ±0.15mm |
| 24 | Countersink hole fabrication angle | 90°-180° 25 Max. aspect ratio 10:1 |
| 26 | Max. plating aspect ratio of blind holes | 0.6:1 |
| 27 | Impedance Tolerance | ±10% (≥50Ω)、±5Ω (35～49Ω) |
| 28 | Soldermask registration precision | ±0.035mm |
| 29 | Min. solder mask opening | 0.0375mm |
| 30 | Min. soldermask bridge | 0.075mm |
| 31 | V-Cut angle | 30°、45°、60° (±5°) |
| 32 | Min. V-cut board thickness | 0.2mm |
| 33 | Profiling Method | Routing & Punching |
| 34 | Dimensional tolerance | ±0.10mm |
| 35 | Beveling depth tolerance | ±0.15mm |
| 36 | Surface Finish | OSP, Peelable Solder Mask, carbon ink, ENIG,ENEPIG,Hard Gold,HASL (lead free), Immersion Sn, immersion silver,Gold fingers plating, |
| 37 | HASL TK tolerance | 0.5um-40um |
| 38 | OSP | 0.2-0.4um |
| 39 | Ni Thickness(ENIG) | 2.54-5um |
| 40 | Au Thickness(ENIG) | 0.025-0.20um |
| 41 | Immersion Sn TK | 1.0-1.4um |
| 42 | Immersion Ag TK | 0.15-0.4um |
| 43 | Gold-plating finger Au TK (MAX) | 1.5um |
| 44 | Carbon ink TK (MIN) | 10um |
| 45 | Carbon ink width (MIN) | 0.4mm |
| 46 | Carbon ink spacing (MIN) | 0.3mm |
| 47 | Warpage (min) | 0.50% |
| 48 | Flammability | 94V-0 |
